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Western Digital Intros World’s First 512 Gigabit 64-Layer 3D NAND Chip

Western Digital has today announced that it has commenced pilot production of the company’s 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan. Mass production...

AMD reveals details of new ARM chip

In a bid to target new markets, Advanced Micro Devices (AMD) has unveiled chips designed to run slot machines, factory robots, airport signs, medical equipment and other devices.